Prototyping and production of printed circuits

• Single sided: Many laminates and copper weights available
• Double sided: Through hole and SMT applications
• Multilayer: New high reliability process.
• Flexible Circuits: On substrates selected to match your cost and performance objectives.

Substrates

• CEM-1: Composit material ideal for high volume production.  Very machinable and punchable.  Single sided only.
• CEM-2: Composit material ideal for high volume production.  Very machinable and punchable.  Double sided only.
• FR-4:  Standard epoxy glass laminate. The most widely used by far.
• FR-406:  Tetrafunctional Epoxy high grade version of FR-4
• Polyimide:  Very high temperature applications ( down hole )
• Teflon:  Specialty RF substrate.  Good for microwave frequencies
• GETEK:  Tetrafunctional Epoxy, low RF loss, high temperature resistance. Preferred for difficult multilayer fabrication.
• DUROID: Specialty RF substrate. Great for microwave frequency

Surface Finishes

• Soldermask: SR1020 glossy green screen printable or for flexible applications PSR-9000 high performance liquid photo-imageable
• Legend/Overlay Printing: White, Yellow, Black   or any colour you want!
• Gold Immersion:  Excellent for high temperature or contaminant resistance.
• Silver Immersion:  Eddy Electronics was one of the very first!  Highly solderable and good shelf life.  We put this on almost all of our boards.

Plating and Development Services

• Pyrophosphate copper:  For high strength and ductility.  Best for conductivity and solderability.  Good density and very resistant to cracking through thermal cycles.
• Silver, Gold, Nickel, Palladium, Cobalt, Tin for electronic or development applications as Electrodeposit, Immersion or Electroless deposit