Services Offered By Eddy Electronics      Prototyping and production of printed circuits Single sided: Many laminates and copper weights available Double sided: Through hole and SMT applications Multilayer: New high reliability process. Flexible Circuits: On substrates selected to match your cost and performance objectives. Substrates CEM-1: Composit material ideal for high volume production.  Very machinable and punchable.  Single sided only. CEM-2: Composit material ideal for high volume production.  Very machinable and punchable.  Double sided only. FR-4:  Standard epoxy glass laminate. The most widely used by far. FR-406:  Tetrafunctional Epoxy high grade version of FR-4 Polyimide:  Very high temperature applications ( down hole ) Teflon:  Specialty RF substrate.  Good for microwave frequencies GETEK:  Tetrafunctional Epoxy, low RF loss, high temperature resistance. Preferred for difficult multilayer fabrication. DUROID: Specialty RF substrate. Great for microwave frequency Surface Finishes Soldermask: SR1020 glossy green screen printable or for flexible applications PSR-9000 high performance liquid photo-imageable Legend/Overlay Printing: White, Yellow, Black   or any colour you want! Gold Immersion:  Excellent for high temperature or contaminant resistance. Silver Immersion:  Eddy Electronics was one of the very first!  Highly solderable and good shelf life.  We put this on almost all of our boards. Plating and Development Services Pyrophosphate copper:  For high strength and ductility.  Best for conductivity and solderability.  Good density and very resistant to cracking through thermal cycles. Silver, Gold, Nickel, Palladium, Cobalt, Tin for electronic or development applications as Electrodeposit, Immersion or Electroless deposit